Processing of glass fiberboard

Information on the processing of glass fiberboardĀ 

processing of glass fiberboard
In the electronic power industry, fiberglass panels are also an important raw material, and more understanding of fiberglass panels is also conducive to future practical operations. The following are some of the information about the processing of fiberglass panels and fiberglass panels, I hope to help everyone.

What kind of material is fiberglass board? What is the difference between epoxy board and FR-4 board?

Fiberglass board is the abbreviation of fiberglass board, also known as glass fiber composite board. The composition mainly includes glass fiber material and composite material. The requirement for composite material here is high heat resistance. It is worth noting that it is not Containing asbestos harmful to the human body, it can be said to be a safe material.

Because the main application industry of fiberglass board is the electronic power industry, there is also a requirement for heat resistance. The fiberglass board has good heat resistance, and the moisture resistance is also good. The mechanical properties and dielectric properties are The most basic performance of fiberglass panels, in practical applications, glass fiberboards must be processed, so certain processing performance is also one of the basic properties of fiberglass panels.

Fiberglass panels are the main raw materials for plastic molds, injection molds, machine tools, molding machines, drilling machines, injection molding machines, motors, PCBs, ICT fixtures, and countertop grinding pads. Injection mold molding usually requires: high temperature materials and low temperature molds. Insulation methods must be used in the same machine. Keeping the mold cold at the same time does not make the temperature of the injection molding machine too high. This requirement can be met by installing an insulating insulation panel between the injection molding and the injection molding machine. Shorten the production cycle, increase productivity, reduce energy consumption, and improve the quality of finished products. The continuous production process ensures stable product quality, prevents overheating of the machine, no electrical failure, and no oil leakage in the hydraulic system.

Glass fiber board and epoxy board and FR-4 board are the main components of the production circuit board. The difference is not very large, but the similarities are more. The fiberglass board is essentially a substrate glass fiber cloth; the epoxy board is a binder which is an epoxy resin; and the FR-4 board is a base material cotton fiber paper. Fundamentally, they are all products of epoxy resin.

glass insulation

Compare the fiberglass board with the epoxy board, then look at the glass fiber board and the half fiberglass board.

Semi-glass fiberboard, it is not difficult to see from the name, part of the composition is glass fiber, and part of it is chemical fiber or cotton resin synthesized by high pressure and high temperature. In the glass fiber board, most of the components are glass fiber, and other materials account for a small part, so the fiberglass board has the characteristics of sound absorption, sound insulation, heat insulation, environmental protection, and flame retardancy. It is generally used for the soft base layer, and is covered with fabric, leather, etc., to make beautiful wall and ceiling decoration.

What are the temperature requirements of the fiberglass board in the actual processing, such as the temperature of the glass fiber board over reflow, what solder paste is used in the reflow soldering?

When the glass fiber board is reflowed, of course, it depends on the actual operating environment and other uncontrollable factors. There are three main points to note:

First: What kind of solder paste can be used for ordinary glass fiberboard, but it should be noted that white PCB board should use low temperature solder paste below 220C to avoid PCB discoloration. Also pay attention to the temperature resistance requirements of special electronic components. Cream, must be in accordance with customer requirements;

Second: the preheating temperature is 150-220, the welding zone is 255-270, and the low temperature solder paste is proportional to the temperature of the solder paste.

Third: pay attention to the quality of the tin point, adjust the speed and the temperature of each zone to meet the standard.

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