Performance requirements for electronic glass cloth

Electronic glass cloth is one of the three main raw materials of copper clad laminate. Some important properties of CCL are closely related to the properties and quality of glass cloth. Zhongtian Electric Equipment Group reminding you that glass fabric, fiber composition, structure appearance and internal quality of yarn and cloth, and surface treatment not only direct the performance and use of copper cladding, but also affect the manufacturing process of the copper clad plate. The technical requirements of the electronic industry for glass cloth are getting higher and higher.

Its requirements can be roughly summed up as follows:

Good dimensional stability

In the manufacturing process of the PCB, there are many chemical and thermal physical processes, which require the plate to maintain a stable size after finishing, and do not produce distortions and warping. Glass cloth is the structural material of PCB. The dimensional stability of cloth is the basic guarantee for dimensional stability of sheet metal. The instability factors of glass cloth mainly come from the structural instability and stress imbalance of warp and weft yarns and fabrics.

Mechanical properties and drilling machinability
The miniaturization trend of the development of PCB technology makes the circuit more and more dense on the unit area, and puts forward higher requirements for the mechanical properties and drilling machinability of the plate. The mechanical properties of PCB depend mainly on the mechanical properties of glass cloth. The strength loss of the glass cloth after heat cleaning is great, but if the heat cleaning effect is sacrificed to improve the retention strength of the processing cloth, the combination of the resin and glass will be affected, and the mechanical properties of the laminated material will also be reduced.

Resistance to soldering resistance
Electronic cloth is usually subjected to thermal cleaning and surface chemical treatment, and glass fiber has a good bond with resin. During the manufacturing process of PCB, it is necessary to pass the chemical corrosivity water solution etching circuit, and the hot solder soldering with temperature up to 260 degrees. In this process, the copper cladding may rebreathe water and turn to steam to gather around the glass fiber, causing the resin to separate from the glass, forming white spots and even bubbles.

Table and smoothness
The electronic fabric is all plain woven fabric. The warp and weft yarn formed by warp and weft yarn is often buckling on the surface of the copper clad laminate. The more rough the cloth is, the more obvious the cloth surface is, the worse the surface smoothness of the plate is, and the smoothness of the surface depends mainly on the smoothness of the cloth surface.

Excellent electrical properties
The development of electronic technology needs to carry and transmit more information in limited space. The development trend of the corresponding PCB is miniaturization, denseness and multilayer of the circuit. The electrical insulation performance of the plate is more stringent. The glass cloth is the insulating base material of the copper clad plate. The electrical insulation performance of the copper clad plate depends on the electrical insulation property of the glass cloth.

Uniformity of material
The PCB is the core control component of computer, program-controlled telephone, program control machine and various electrical appliances. It is connected with other parts through the socket, and there are many connected nodes in the inner layer of the multilayer board. The uniformity of the material of the circuit board depends largely on the uniformity of the material of the glass cloth. The manufacturing process of the copper clad plate also puts forward high requirements for the uniformity of the material of the glass cloth. The key index of the uniformity of the material of the glass cloth is the allowable tolerance for the unit area quality of the cloth.

The FR-4 insulation board of Zhongtian Electric Equipment Group uses epoxy resin impregnated with electronic cloth, semi – solidified after cutting, several layers overlapping, one or two sides overlying copper foil, and then hot pressing to make one side or double side copper clad plate. Glass cloth in copper clad laminate is reinforced material and insulating material, epoxy resin is a binder, and both constitute insulating substrate together. The surface covered copper foil is used for printed circuit. If you need FR-4 epoxy panels or CCL, you can contact the online customer service.

leave a message

Ztelec Group