Regarding the issue of “classification of the insulation grade of epoxy board“, I think it is necessary to share it with you. Let more people know it. As we all know, epoxy resin is an insulating material. The insulation performance is closely related to the temperature, and the higher the temperature, the worse the insulation performance.
In order to ensure the insulation strength, each insulation material has a maximum permissible operating temperature within a suitable range at which it can be used safely for a long period of time. However, once it is above this temperature, the insulation material will age quickly.
According to heat resistance, insulation materials are classified into Y, A, E, B, F, H, C, and the like. For example, the maximum allowable operating temperature for Class A insulation is 105°C. In a general-purpose distribution transformer, most of the insulation material of the motor belongs to Class A. Such as epoxy resin insulation board.
What are the characteristics of epoxy board application?
1, mechanical properties. The cured epoxy resin system has excellent mechanical properties.
2, easy to cure. With a variety of different curing agents, the epoxy resin system can be cured in the temperature range of 0-180°C.
3, various forms. A variety of resins, curing agents, and modifier systems can be adapted to suit the requirements of various applications, ranging from very low viscosity to high melting point solids.
4, strong adhesion. The presence of polar hydroxyl groups and ether bonds inherent in the epoxy resin chain gives it high adhesion to various substances. The shrinkage of the epoxy resin when cured is low and the resulting internal stress is small, which also helps to increase the adhesive strength.
5, low shrinkage. The reaction of the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization of epoxy groups in the resin molecules, without the release of water or other volatile by-products. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.
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