Epoxy insulation board

Epoxy insulation board

Epoxy insulation board

The glass fiber cloth is made of epoxy resin bonded and heated and pressed, and has high mechanical properties at medium temperature and stable electrical properties at high temperatures. Suitable for high-insulation structural parts for machinery, electrical appliances and electronics, with high mechanical and dielectric properties, as well as good heat and moisture resistance. Heat resistance class F (155 ° C).

Epoxy insulation board Specification thickness 0.5~100mm Conventional specification 1020mm*1220mm Color: yellow Water green Deformed by heat at 180°C, generally not heated with other metals, may cause deformation of sheet metal

An epoxy insulating board generally refers to an organic polymer compound containing two or more epoxy groups in a molecule, and their relative molecular masses are not high except for a few. The molecular structure of the epoxy resin is characterized by the presence of an active epoxy group in the molecular chain, and the epoxy group may be located at the end, in the middle or in a ring structure of the molecular chain. Since the molecular structure contains an active epoxy group, they can be cross-linked with various types of curing agents to form an insoluble, infusible polymer having a three-dimensional network structure.

1. Various forms. A wide variety of resins, curing agents, and modifier systems can be adapted to the requirements of the various applications, ranging from very low viscosities to high melting point solids.
2. Easy to cure. Epoxy resin system can be cured in the temperature range of 0-180 °C by using various curing agents.
3. Strong adhesion. The presence of polar hydroxyl and ether linkages inherent in the epoxy resin molecular chain provides high adhesion to a wide variety of materials. When the epoxy resin is cured, the shrinkage is low and the internal stress is small, which also contributes to the improvement of the adhesion strength.
4. Low shrinkage. The reaction of the epoxy resin and the curing agent used is carried out by a direct addition reaction or a ring-opening polymerization reaction of an epoxy group in a resin molecule, without the release of water or other volatile by-products. They exhibit very low shrinkage (less than 2%) during curing compared to unsaturated polyester resins and phenolic resins.
5. Mechanical properties. The cured epoxy resin system has excellent mechanical properties.

Disadvantages: too strong when processing

leave a message

Ztelec Group