Polyimide Film is synthesized by the polycondensation of aromatic dianhydride and aromatic diamine (PMDA and ODA ). It shows outstanding physical , thermal, electrical, and chemical properties over a wide range of temperature as low as -452F(-269C) and as high as 500F(+260C).It also offers good dimensional stability and can be die-cut, laminated, metallized, formed, thermoformed or adhesive coated.
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