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Polyimide Film Adhesive Tape

Polyimide Film Adhesive Tape is produced from polyimide film coated with heat resistant adhesive.It is an ideal insulating product for H class use.

Characters: Excellent heat resistance: can work for a long time at 180℃ and endure heat shock of 160℃.
Better tear resistance: it can work on the surface with different shapes and sizes.
Higher mechanical strength, better dielectric strength and good bonding strength.
Application: It is widely used in ground insulation, phase insulation, layer insulation, barrier insulation and core wrap for electrical motors and transformers; also used in PCB wave soldering, hot air leveling and other bonding applications under high temperature and corrosion conditions.


Items Unit  Standard Value
Apperance Smooth surface free from wrinkles, blister and impurity.
Typical Thickness mm 0.06
Thickness Scope mm 0.05~0.07
Polyimide film thickness  mm 0.025
Breakdown strength  Kv ≥6.5
Tensile strength  N/25mm ≥135
Elongation % ≥50

Notice: the above table reflects only typical or average data , just for providing practical advice in practical application as far as possible, the data does not assume any responsibility for the use of the product or legal liability. 
 

Categories: Flexible Composite