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Epoxy insulation board definition and characteristics

Epoxy insulation boards generally refer to organic polymer compounds that contain two or more epoxy groups in the molecule. The relative molecular mass of insulation ladders other than individuals is not high. The molecular structure of the epoxy resin is based on its characteristics in the molecular chain contained in the reactive epoxy, epoxy can be located at the end of the molecular chain, in the middle, or can form a ring structure, then the characteristics of epoxy insulating board What?

Epoxy insulation board
1, strong adhesion. The inherent epoxy resin has various molecular substances, such as the presence of polar hydroxyl groups and ether bonds, and it has a high adhesive force. The shrinkage of the epoxy during curing is low and the resulting internal stress is small, which also helps to increase the adhesion strength.

2, curing is convenient. With the choice of a variety of different curing agents, epoxy resin systems can cure virtually within the temperature range of 0 to 180°C. Mechanical behavior. The cured epoxy resin system has excellent mechanical properties.

3, form. Various resins, curing agents, and modifier systems can be presented in almost adaptable forms, and their range can range from low viscosity to high solid melting point requirements for a variety of applications.

4. The shrinkage rate is low. The reaction of the epoxy resin and the curing agent used is an addition reaction by direct ring-opening polymerization or an epoxy-based resin molecule with or without the discharge of volatile by-products. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage during curing.

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