FR5(EPGC204) Epoxy resin fiberglass mesh insulation plate board
Epoxy board, also known as epoxy glass fiberboard, epoxy phenolic laminated glass cloth, epoxy resin refers to molecules containing two or more epoxy groups of organic polymers, with a few, their The relative molecular mass is not high. The molecular structure of epoxy resin is characterized by containing active epoxy groups in the molecular chain. Epoxy groups can be located in the terminal, middle or ring structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can cross-react with various types of curing agents to form insoluble and infusible polymers with three-dimensional network structure.
Application features for FR5(EPGC204) epoxy resin fiberglass mesh insulation plate board
1, Various forms: a variety of resins, curing agent, modifier system can adapt to almost all forms of application requirements, its range can be from very low viscosity to high melting point solid.
2, Easy to cure: Choose a variety of different curing agent, epoxy resin system can be cured almost in the temperature range of 0 ~ 180 ℃.
3, Strong adhesion: Epoxy resin chain inherent in the presence of hydroxyl and ether bond, so that it has a high adhesion to various substances. Low shrinkage of the epoxy resin curing, the resulting internal stress is small, which also helps to improve the adhesion strength.
4. Low Shrinkage: The reaction of the epoxy resin with the curing agent used is carried out by direct addition reaction or ring-opening polymerization of the epoxy groups in the resin molecules without the release of water or other volatile by-products. They show very low shrinkage (less than 2%) during curing as compared to unsaturated polyester resins, phenolic resins.
5, Mechanical properties. The cured epoxy resin system has excellent mechanical properties.
Technical parameter for FR5(EPGC204) epoxy resin fiberglass mesh insulation plate board